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urea derivatives examples

11. No. A process for the preparation of a compound of the following formula (Ia), X (Ia) R 1 -CH 2 a O-A-NHCNH-R 2 *b* wherein R 1 indicates a piperidino group or pyrrolidino group which may be substituted with hydroxy group or lower alky- group having 1 to 3 carbon atoms; A indicates an ethylene group, propy- lene group, butylene group or butenylene group; R 2 indicates a straight or branched alkyl group having 1 to 20 carbon atoms, cycloalkyl group having 3 to 6 carbon atoms, benzyl group, or \ei-eA -Fro~r\ phenyl group which may have 1 to 3 substituents uch,-ac \lower alkyl group having 1 to 3 carbon atoms, lower alkoxy group having 1 to 3 carbon atoms, halogen atom, trifluoromethyl group, amino -28- 16 group, nitro group or methylenedioxy group; X 1 indicates an oxygen atom, the hydrates and pharmaceutically acceptable acid addition salts thereof; which comprises condensing the compound of the following formula (II), R 1 -CH 2 O-A-NH 2 2 *o wherein R and A are same as defined above; with the compound of 1 S, the following formula (IV), SH 2 N-R 2 (IV) to wherein R 2 is same as defined above; in the presence of N,N'- carbonyldiimidazole. The organic layer was washed with saturated aqueous sodium chloride solution, dried over anhydrous magnesium sulfate and concentrated under reduced pressure to give the crude precipitate (3.8 g; yield 88.4 This precipitate was recrystallized two times from ethanol to give the title compound (1.8 mp 116-118 °C. 2.5 μm (UR 500), Dyhard MIA 5 (Degussa): micronized adduct of methylimidazole with bisphenol A resin (Epikote 828), particle size 98% <70 μm, N,N-dimethylurea or 1,1-dimethylurea (Merck): ground in the laboratory, particle size 98% <10 μm, 50% approx. Many of the compounds employed as latent accelerators exhibit inadequate solubility in common solvents, thereby significantly reducing their spectrum of application, particularly in sectors in which a uniform reaction is needed. Typically, they can be prepared by the direct reaction of amines represented oy the general formula (IV) with imidazolecarbonylamides, which are obtained from amines with N,N'-carbonyldiimidazole. Usually the individual components of epoxy resin formulations are not mixed together until immediately before curing and heating, in order to prevent premature reaction. Example 63 The analytical data of the compound of Example 63, synthesized as same manner as the process of Example 62, is summarized in Table 3. 13. EP 148 365 A1, U.S. Pat. AU611705B2 AU20247/88A AU2024788A AU611705B2 AU 611705 B2 AU611705 B2 AU 611705B2 AU 20247/88 A AU20247/88 A AU 20247/88A AU 2024788 A AU2024788 A AU 2024788A AU 611705 B2 AU611705 B2 AU 611705B2 Authority AU Australia Prior art keywords indicates carbon atoms compound formula alkyl Prior art date 1987-08-03 Legal status (The legal status is an assumption and is not a … ーカ・テクノロジー・アーゲー, AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW, BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG, A study on properties of epoxy resin toughened by functionalized polymer containing rigid, rod-like moiety, Use of urea-derivatives as accelerators for epoxy resins, Substituted urea accelerator with dicyandiamide for epoxy resin systems, Use of urea derivatives as accelerating agents for epoxy resins, Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator, Heat hardened epoxy resin compound containing a catalyst with heteroatoms, Silane/urea compound as heat-activated hardener for epoxy resin compounds, Heat curable epoxy resin composition with water as foaming agent, Use of N, N '(-dimethyl) -units and methods for curing epoxy resin compositions, Alkyl or dialkyl semicarbazones as hardeners for epoxy resins, Liquid hardeners for hardening epoxide resins (II), Semicarbazones as accelerators for curing epoxy resins, Epoxy resin composition for fiber reinforced composite materials, pre-impregnated fast curing epoxy resins obtained from these, Prepregs for manufacturing composite materials, A kind of epoxy resin lalent solidifying agent and corresponding epoxypaint, Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance, System, method, and apparatus for remote patient care, Epoxy dual cure resins for additive manufacturing, Dual precursor resin systems for additive manufacturing with dual cure resins, A kind of temperature curing epoxy low Resin adhesive and preparation method thereof, Epoxy resin composition for sealing semiconductor, Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature, Acrylic copolymer for thermosetting pressure-sensitive adhesive composition, Epoxy resin composition for printed-wiring board, Sealing agent for liquid-crystal display, cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element, Thermosetting epoxy resin composition containing an accelerator having a hetero atom, Heat-curing epoxy resin composition comprising an accelerator having heteroatoms, Silane/urea compound as a heat-activated curing agent for epoxide resin compositions, Use of N,N′-(dimethyl) urones and method for curing epoxy resin compositions, Alkyl or dialkyl-semicarbazone as a hardener for epoxy resin, Use of n,n'-(dimethyl) urons and method for curing epoxy resin compositions, Liquid hardeners for hardening epoxide resins (I), High Tg epoxy systems for composite applications, Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof, Curing agent for epoxy resin systems and their use, Low moisture absorption epoxy resin systems, Preimpregnated reinforcements and high strength composites therefrom, Halogen free benzoxazine based curable compositions for high Tg applications, Epoxy resins comprising a cycloaliphatic diamine curing agent, Thermoplastic modified epoxy compositions, Core/shell rubbers for use in electrical laminate compositions, Epoxy-imidazole catalysts useful for powder coating applications, Network polymers comprising epoxy-terminated esters, Metallic compounds in non-brominated flame retardant epoxy resins, Hardening powder coatings hardening at low temperature and method of application therefor, Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins, Epoxy resin composition and prepreg made with the epoxy resin composition, Epoxy resin based core filler material developing low exothermic heat, Designated countries for regional patents, Ep: the epo has been informed by wipo that ep was designated in this application, Wipo information: entry into national phase, Wipo information: published in national office, Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101).

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